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DPE41257-70I

DPAC TECHNOLOGIES CORP

DPAC TECHNOLOGIES CORP DPE41257-70I
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Page Size
    32 words
  • Technology
    CMOS
  • Toggle Bit
    NO
  • Data Polling
    YES
  • JESD-30 Code
    R-XDIP-T28
  • Memory Width
    8
  • Organization
    256KX8
  • Package Code
    DIP
  • JESD-609 Code
    e0
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • Memory Density
    262144 bit
  • Memory IC Type
    EEPROM MODULE
  • Terminal Pitch
    2.54 mm
  • Access Time-Max
    70 ns
  • Number of Words
    262144 words
  • Parallel/Serial
    PARALLEL
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    DUAL
  • Number of Terminals
    28
  • Number of Words Code
    256K
  • Qualification Status
    Not Qualified
  • Package Body Material
    CERAMIC
  • Package Equivalence Code
    DIP28,.6
  • Operating Temperature-Max
    85 Cel
  • Operating Temperature-Min
    -40 Cel
  • Supply Voltage-Nom (Vsup)
    5 V

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DPE41257-70I
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DPE41257-70I