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DPE1124A-250B

DPAC TECHNOLOGIES CORP

DPAC TECHNOLOGIES CORP DPE1124A-250B
  • ECCN
    3A001.a.2.c
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Technology
    CMOS
  • Toggle Bit
    NO
  • Data Polling
    YES
  • JESD-30 Code
    R-XDIP-T56
  • Memory Width
    16
  • Package Code
    DIP
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • J-STD-609 Code
    e0
  • Memory IC Type
    EEPROM MODULE
  • Parallel/Serial
    PARALLEL
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • DLA Qualification
    Not Qualified
  • Page Size (words)
    256
  • Temperature Grade
    MILITARY
  • Terminal Position
    DUAL
  • Memory Organization
    64KX16
  • Number of Terminals
    56
  • Terminal Pitch (mm)
    2.54
  • Access Time-Max (ns)
    250
  • Number of Words Code
    64K
  • Memory Density (bits)
    1048576
  • Package Body Material
    CERAMIC
  • Supply Voltage-Nom (V)
    5
  • Number of Words (words)
    65536
  • Standby Current-Max (A)
    0.48
  • Supply Current-Max (mA)
    660
  • Package Equivalence Code
    DIP56,1.5
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -55
  • Screening Level / Reference Standard
    MIL-STD-883 Class B (Modified)

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DPE1124A-250B
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DPE1124A-250B