DPAC TECHNOLOGIES CORP DP3S512X32MXP-15C | 搜芯易Sourcengine

DPAC TECHNOLOGIES CORP DP3S512X32MXP-15C

生命周期状态
Transferred
说明
SRAM Module, 2MX8, 15ns, CMOS
类别
Semiconductors Memory ICs SRAMs SRAM MODULE

ECCN
3A991.b.2.a
ECCN Governance
EAR
HTS Code
8542.32.00.41
SB Code
8542.32.00.40

Technology
CMOS
JESD-30 Code
S-XQMA-J68
Memory Width
8
Package Shape
SQUARE
Package Style
MICROELECTRONIC ASSEMBLY Meter
Surface Mount
YES
Terminal Form
J BEND
Memory IC Type
SRAM MODULE
Operating Mode
ASYNCHRONOUS
Parallel/Serial
PARALLEL
DLA Qualification
Not Qualified
Temperature Grade
COMMERCIAL
Terminal Position
QUAD
Additional Feature
CONFIGURABLE AS 1M X 16 OR 512K X 32
Memory Organization
2MX8
Number of Functions
1
Number of Terminals
68
Access Time-Max (ns)
15
Number of Words Code
2M
Memory Density (bits)
16777216
Package Body Material
UNSPECIFIED
Supply Voltage-Max (V)
3.6
Supply Voltage-Min (V)
3
Supply Voltage-Nom (V)
3.3
Number of Words (words)
2097152
Operating Temperature-Max (Cel)
70
Operating Temperature-Min (Cel)
0