DPAC TECHNOLOGIES CORP DP3S1MX32PY5-20CI | 搜芯易Sourcengine

DPAC TECHNOLOGIES CORP DP3S1MX32PY5-20CI

生命周期状态
Discontinued
说明
SRAM Module, 1MX32, 20ns, CMOS
类别
Semiconductors Memory ICs SRAMs SRAM MODULE

ECCN
3A991.b.2.a
ECCN Governance
EAR
HTS Code
8542.32.00.41
SB Code
8542.32.00.40

I/O Type
COMMON
Technology
CMOS
JESD-30 Code
R-XQMA-N80
Memory Width
32
Package Code
QCCN
Package Shape
RECTANGULAR
Package Style
MICROELECTRONIC ASSEMBLY Meter
Surface Mount
YES
Terminal Form
NO LEAD
J-STD-609 Code
e0
Memory IC Type
SRAM MODULE
Operating Mode
ASYNCHRONOUS
Parallel/Serial
PARALLEL
Terminal Finish
Tin/Lead (Sn/Pb)
DLA Qualification
Not Qualified
Temperature Grade
INDUSTRIAL
Terminal Position
QUAD
Memory Organization
1MX32
Number of Functions
1
Number of Terminals
80
Terminal Pitch (mm)
0.8
Access Time-Max (ns)
20
Number of Words Code
1M
Memory Density (bits)
33554432
Package Body Material
UNSPECIFIED
Output Characteristics
3-STATE
Supply Voltage-Max (V)
3.6
Supply Voltage-Min (V)
3
Supply Voltage-Nom (V)
3.3
Number of Words (words)
1048576
Standby Current-Max (A)
0.008
Standby Voltage-Min (V)
3
Supply Current-Max (mA)
900
Package Equivalence Code
LCC80,.5X.97,32
Operating Temperature-Max (Cel)
85
Operating Temperature-Min (Cel)
-40