产品制造商
提交询价BOM 工具

DM28HC64H-70

SEEQ TECHNOLOGY INC

SEEQ TECHNOLOGY INC DM28HC64H-70
  • ECCN
    3A001.a.2.c
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Technology
    CMOS
  • Toggle Bit
    NO
  • Data Polling
    YES
  • JESD-30 Code
    R-GDIP-T28
  • Memory Width
    8
  • Package Code
    DIP
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • J-STD-609 Code
    e0
  • Memory IC Type
    EEPROM
  • Operating Mode
    ASYNCHRONOUS
  • Parallel/Serial
    PARALLEL
  • Terminal Finish
    TIN LEAD
  • DLA Qualification
    Not Qualified
  • Page Size (words)
    32
  • Temperature Grade
    MILITARY
  • Terminal Position
    DUAL
  • Additional Feature
    AUTOMATIC WRITE;PAGE WRITE;BULK ERASE
  • Memory Organization
    8KX8
  • Number of Functions
    1
  • Number of Terminals
    28
  • Terminal Pitch (mm)
    2.54
  • Access Time-Max (ns)
    70
  • Number of Words Code
    8K
  • Memory Density (bits)
    65536
  • Package Body Material
    CERAMIC, GLASS-SEALED
  • Command User Interface
    NO
  • Supply Voltage-Max (V)
    5.5
  • Supply Voltage-Min (V)
    4.5
  • Supply Voltage-Nom (V)
    5
  • Number of Words (words)
    8192
  • Programming Voltage (V)
    5
  • Standby Current-Max (A)
    0.00025
  • Supply Current-Max (mA)
    80
  • Package Equivalence Code
    DIP28,.6
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -55
  • Write Cycle Time-Max (tWC) (ms)
    1

DM28HC64H-70有0家供应商货源可供购买或竞价

提交询价

您的询价单将直接发送给我们的销售专家: Pari

提交询价
DM28HC64H-70
提交询价
DM28HC64H-70