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DEI1166-TMS

DEVICE ENGINEERING INC

DEVICE ENGINEERING INC DEI1166-TMS
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • Width
    4.4 mm
  • Length
    7.8 mm
  • JESD-30 Code
    R-PDSO-G24
  • Package Code
    TSSOP
  • JESD-609 Code
    e0
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • Terminal Pitch
    0.65 mm
  • Terminal Finish
    TIN LEAD
  • Interface IC Type
    INTERFACE CIRCUIT
  • Seated Height-Max
    1.2 mm
  • Temperature Grade
    MILITARY
  • Terminal Position
    DUAL
  • Additional Feature
    ALSO REQUIRES SUPPLY OF 5 V
  • Supply Voltage-Max
    3.63 V
  • Supply Voltage-Min
    2.97 V
  • Supply Voltage-Nom
    3.3 V
  • Number of Functions
    1
  • Number of Terminals
    24
  • Supply Voltage1-Max
    18 V
  • Supply Voltage1-Min
    5 V
  • Supply Voltage1-Nom
    14 V
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Operating Temperature-Max
    125 Cel
  • Operating Temperature-Min
    -55 Cel
  • Moisture Sensitivity Level
    2
  • Peak Reflow Temperature (Cel)
    240
  • Time@Peak Reflow Temperature-Max (s)
    30

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DEI1166-TMS