Kingston Technology Company, Inc. D2516ECMDXGJD | 搜芯易Sourcengine

Kingston Technology Company, Inc. D2516ECMDXGJD

生命周期状态
Active
RoHS
符合RoHS标准
说明
DDR3L DRAM, 256MX16, CMOS, PBGA96
类别
Semiconductors Memory ICs DRAMs DDR3L DRAM

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.36
SB Code
8542.32.00.23

Technology
CMOS
JESD-30 Code
R-PBGA-B96
Memory Width
16
Package Code
BGA
Self Refresh
YES
Package Shape
RECTANGULAR
Package Style
GRID ARRAY Meter
Surface Mount
YES
Terminal Form
BALL
Memory IC Type
DDR3L DRAM
Operating Mode
SYNCHRONOUS
Number of Ports
1
Temperature Grade
OTHER
Terminal Position
BOTTOM
Additional Feature
SELF REFRESH
Memory Organization
256MX16
Number of Functions
1
Number of Terminals
96
Number of Words Code
256M
Memory Density (bits)
4294967296
Package Body Material
PLASTIC/EPOXY
Supply Voltage-Nom (V)
1.35
Number of Words (words)
268435456
Operating Temperature-Max (Cel)
95
Operating Temperature-Min (Cel)
0