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CXP845F60Q-1-XXX

Sony Corporation

Sony Corporation CXP845F60Q-1-XXX
  • ECCN
    3A991.a.2
  • ECCN Governance
    EAR
  • HTS Code
    8542.31.00.15
  • SB Code
    8542.31.00.15
  • Bit Size
    8
  • CPU Family
    SPC700
  • Technology
    CMOS
  • Width (mm)
    14
  • Length (mm)
    20
  • Speed (MHz)
    14
  • ADC Channels
    YES
  • DAC Channels
    NO
  • DMA Channels
    NO
  • JESD-30 Code
    R-PQFP-G80
  • PWM Channels
    YES
  • Package Code
    QFP
  • Boundary Scan
    NO
  • Package Shape
    RECTANGULAR
  • Package Style
    FLATPACK Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • Address Bus Width
    0
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    QUAD
  • Number of I/O Lines
    72
  • Number of Terminals
    80
  • Program Memory Type
    FLASH
  • Terminal Pitch (mm)
    0.8
  • Data RAM Size (bytes)
    1472
  • Package Body Material
    PLASTIC/EPOXY
  • Supply Voltage-Max (V)
    5.5
  • Supply Voltage-Min (V)
    5
  • Supply Voltage-Nom (V)
    5
  • External Data Bus Width
    0
  • Supply Current-Max (mA)
    66
  • Package Equivalence Code
    QFP80,.7X.9,32
  • Clock Frequency-Max (MHz)
    28
  • Program Memory Size (words)
    61440
  • Program Memory Width (bits)
    8
  • uPs/uCs/Peripheral ICs Type
    MICROCONTROLLER
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    -20

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