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CXP82960

Sony Corporation

Sony Corporation CXP82960
  • HTS Code
    8542.31.00.01
  • SB Code
    8542.31.00.15
  • Bit Size
    8
  • Technology
    CMOS
  • Width (mm)
    14
  • Length (mm)
    20
  • Speed (MHz)
    16
  • ADC Channels
    YES
  • DAC Channels
    NO
  • DMA Channels
    NO
  • JESD-30 Code
    R-PQFP-G80
  • PWM Channels
    NO
  • Package Code
    QFP
  • Package Shape
    RECTANGULAR
  • Package Style
    FLATPACK Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • J-STD-609 Code
    e6/e4
  • Terminal Finish
    TIN BISMUTH/PALLADIUM
  • Address Bus Width
    0
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    COMMERCIAL EXTENDED
  • Terminal Position
    QUAD
  • Number of I/O Lines
    48
  • Number of Terminals
    80
  • Program Memory Type
    MROM
  • Terminal Pitch (mm)
    0.8
  • Package Body Material
    PLASTIC/EPOXY
  • Supply Voltage-Max (V)
    5.5
  • Supply Voltage-Min (V)
    4.5
  • Supply Voltage-Nom (V)
    5
  • External Data Bus Width
    0
  • Clock Frequency-Max (MHz)
    16
  • uPs/uCs/Peripheral ICs Type
    MICROCONTROLLER
  • Peak Reflow Temperature (Cel)
    260
  • Operating Temperature-Max (Cel)
    75
  • Operating Temperature-Min (Cel)
    -20
  • Time@Peak Reflow Temperature-Max (s)
    10

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CXP82960
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CXP82960