SMK CORP CLC1418-0111 | 搜芯易Sourcengine

SMK CORP CLC1418-0111

生命周期状态
Contact Mfr
说明
IC Socket, DIP18, 18 Contact(s), 2.54mm Term Pitch, 0.45inch Row Spacing, Solder
类别
Interconnects Sockets and Chip Carriers

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8536.69.40.40
SB Code
8536.69.40.40

Contact Style
LEAF
Mounting Style
STRAIGHT
Contact Material
BE-CU
Housing Material
POLYSULFONE
Termination Type
SOLDER
Body Length (inch)
0.989
Current Rating (A)
1
Device Socket Type
IC SOCKET
Number of Contacts
18
Body Breadth (inch)
0.968
Device Type Used On
DIP18
PCB Contact Pattern
RECTANGULAR
Terminal Pitch (mm)
2.54
Contact Finish - Mating
AU ON NI
Socket Body Depth (inch)
0.571
Insulation Resistance (ohm)
1000000000
Mating Contact Pitch (inch)
0.1
PCB Contact Row Spacing (mm)
11.43
Operating Temperature-Max (Cel)
150
Dielectric Withstanding Voltage (V)
500VDC