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BCM52311A1HH0H274D

Broadcom Inc.

BCM52311A1HH0H274D 产品规格书
Broadcom Inc. BCM52311A1HH0H274D
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • Width (mm)
    35
  • Length (mm)
    35
  • JESD-30 Code
    S-PBGA-B1152
  • Package Code
    HBGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, HEAT SINK/SLUG Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Telecom IC Type
    TELECOM CIRCUIT
  • Data Rate (Mbps)
    12500
  • Terminal Position
    BOTTOM
  • Number of Functions
    1
  • Number of Terminals
    1152
  • Terminal Pitch (mm)
    1
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    3.21
  • Supply Voltage-Nom (V)
    0.85
  • Package Equivalence Code
    BGA1152,34X34,40
  • Operating Temperature-Max (Cel)
    105
  • Operating Temperature-Min (Cel)
    0

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