SMP TECHNOLOGY INC B014-0630-206-Z | 搜芯易Sourcengine

SMP TECHNOLOGY INC B014-0630-206-Z

生命周期状态
Contact Mfr
说明
IC Socket, DIP6, 6 Contact(s), 2.54mm Term Pitch, 7.62mm Row Spacing, Solder
类别
Interconnects Sockets and Chip Carriers

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8536.69.40.40
SB Code
8536.69.40.40

Body Depth
0.167 inch
Body Length
0.3 inch
Body Breadth
0.398 inch
Contact Style
RND PIN-SKT
Current Rating
3 A
Mounting Style
STRAIGHT
Terminal Pitch
2.54 mm
Contact Material
BE-CU
Housing Material
GLASS FILLED POLYESTER
Termination Type
SOLDER
Additional Feature
ROHS COMPLIANT
Device Socket Type
IC SOCKET
Number of Contacts
6
Device Type Used On
DIP6
PCB Contact Pattern
RECTANGULAR
Mating Contact Pitch
0.1 inch
Insulation Resistance
1000000000 ohm
Contact Finish - Mating
AU
PCB Contact Row Spacing
7.62 mm
Operating Temperature-Max
105 Cel
Operating Temperature-Min
-55 Cel
Contact Finish - Termination
TIN
Dielectric Withstanding Voltage
1000VAC V