MICROSS COMPONENTS AS8SLC512K32P-12/883C | 搜芯易Sourcengine

MICROSS COMPONENTS AS8SLC512K32P-12/883C

生命周期状态
Active
REACH
REACH compliant
说明
SRAM Module, 512KX32, 12ns, CMOS
类别
Semiconductors Memory ICs SRAMs SRAM MODULE

ECCN
3A991.b.2.a
ECCN Governance
EAR
HTS Code
8542.32.00.41
SB Code
8542.32.00.40

I/O Type
COMMON
Technology
CMOS
Width (mm)
27.305
Length (mm)
27.305
JESD-30 Code
S-XPGA-P66
Memory Width
32
Package Code
PGA
Package Shape
SQUARE
Package Style
GRID ARRAY Meter
Surface Mount
NO
Terminal Form
PIN/PEG
J-STD-609 Code
e0
Memory IC Type
SRAM MODULE
Operating Mode
ASYNCHRONOUS
Parallel/Serial
PARALLEL
Terminal Finish
Tin/Lead (Sn/Pb)
DLA Qualification
Not Qualified
Temperature Grade
MILITARY
Terminal Position
PERPENDICULAR
Memory Organization
512KX32
Number of Functions
1
Number of Terminals
66
Terminal Pitch (mm)
2.54
Access Time-Max (ns)
12
Number of Words Code
512K
Memory Density (bits)
16777216
Package Body Material
UNSPECIFIED
Output Characteristics
3-STATE
Seated Height-Max (mm)
4.5974
Supply Voltage-Max (V)
3.6
Supply Voltage-Min (V)
3
Supply Voltage-Nom (V)
3.3
Number of Words (words)
524288
Standby Current-Max (A)
0.06
Standby Voltage-Min (V)
3
Supply Current-Max (mA)
320
Package Equivalence Code
PGA66,11X11
Operating Temperature-Max (Cel)
125
Operating Temperature-Min (Cel)
-55
Screening Level / Reference Standard
MIL-STD-883 Class C