MICROSS COMPONENTS AS8S128K32PN-25/883C | 搜芯易Sourcengine

MICROSS COMPONENTS AS8S128K32PN-25/883C

生命周期状态
Active
REACH
REACH compliant
说明
SRAM Module, 128KX32, 25ns, CMOS, CPGA66
类别
Semiconductors Memory ICs SRAMs SRAM MODULE

ECCN
3A991.b.2.a
ECCN Governance
EAR
HTS Code
8542.32.00.41
SB Code
8542.32.00.40

I/O Type
COMMON
Technology
CMOS
Width (mm)
27.305
Length (mm)
27.305
JESD-30 Code
S-XPGA-P66
Memory Width
32
Package Code
PGA
Package Shape
SQUARE
Package Style
GRID ARRAY Meter
Surface Mount
NO
Terminal Form
PIN/PEG
Memory IC Type
SRAM MODULE
Operating Mode
ASYNCHRONOUS
Parallel/Serial
PARALLEL
DLA Qualification
Not Qualified
Temperature Grade
MILITARY
Terminal Position
PERPENDICULAR
Additional Feature
ALSO CONFIGURABLE AS 512K X 8
Memory Organization
128KX32
Number of Functions
1
Number of Terminals
66
Terminal Pitch (mm)
2.54
Access Time-Max (ns)
25
Number of Words Code
128K
Memory Density (bits)
4194304
Package Body Material
CERAMIC, METAL-SEALED COFIRED
Alternate Memory Width
16
Output Characteristics
3-STATE
Seated Height-Max (mm)
4.953
Supply Voltage-Max (V)
5.5
Supply Voltage-Min (V)
4.5
Supply Voltage-Nom (V)
5
Number of Words (words)
131072
Standby Current-Max (A)
0.006
Standby Voltage-Min (V)
2
Supply Current-Max (mA)
560
Package Equivalence Code
PGA66,11X11
Operating Temperature-Max (Cel)
125
Operating Temperature-Min (Cel)
-55
Screening Level / Reference Standard
MIL-STD-883 Class C