MICROSS COMPONENTS AS7S32K32P-20 | 搜芯易Sourcengine

MICROSS COMPONENTS AS7S32K32P-20

生命周期状态
Contact Mfr
REACH
REACH compliant
说明
SRAM Module, 32KX32, 20ns, CMOS, CPGA66
类别
Semiconductors Memory ICs SRAMs SRAM MODULE

ECCN
3A991.b.2.b
ECCN Governance
EAR
HTS Code
8542.32.00.41
SB Code
8542.32.00.40

I/O Type
COMMON
Technology
CMOS
JESD-30 Code
S-XPGA-P66
Memory Width
32
Package Code
PGA
Package Shape
SQUARE
Package Style
GRID ARRAY Meter
Surface Mount
NO
Terminal Form
PIN/PEG
Memory IC Type
SRAM MODULE
Operating Mode
ASYNCHRONOUS
Parallel/Serial
PARALLEL
DLA Qualification
Not Qualified
Temperature Grade
MILITARY
Terminal Position
PERPENDICULAR
Memory Organization
32KX32
Number of Terminals
66
Terminal Pitch (mm)
2.54
Access Time-Max (ns)
20
Number of Words Code
32K
Memory Density (bits)
1048576
Package Body Material
CERAMIC
Output Characteristics
3-STATE
Supply Voltage-Nom (V)
5
Number of Words (words)
32768
Standby Current-Max (A)
0.02
Standby Voltage-Min (V)
4.5
Supply Current-Max (mA)
600
Package Equivalence Code
PGA66,11X11
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Operating Temperature-Max (Cel)
125
Operating Temperature-Min (Cel)
-55
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED