MICROSS COMPONENTS AS7S128K32P-20M | 搜芯易Sourcengine

MICROSS COMPONENTS AS7S128K32P-20M

生命周期状态
Active
说明
SRAM Module, 512X8, 20ns, CMOS, CPGA66
类别
Semiconductors Memory ICs SRAMs SRAM MODULE

ECCN
3A001.a.2.c
ECCN Governance
EAR
HTS Code
8542.32.00.41
SB Code
8542.32.00.40

Technology
CMOS
JESD-30 Code
S-CPGA-P66
Memory Width
8
Package Code
PGA
Package Shape
SQUARE
Package Style
GRID ARRAY Meter
Surface Mount
NO
Terminal Form
PIN/PEG
J-STD-609 Code
e0
Memory IC Type
SRAM MODULE
Operating Mode
ASYNCHRONOUS
Parallel/Serial
PARALLEL
Terminal Finish
TIN LEAD
DLA Qualification
Not Qualified
Temperature Grade
MILITARY
Terminal Position
PERPENDICULAR
Additional Feature
USER CONFIGURABLE AS 128K X 32 OR 256K X 16
Memory Organization
512X8
Number of Functions
1
Number of Terminals
66
Terminal Pitch (mm)
2.54
Access Time-Max (ns)
20
Number of Words Code
512
Memory Density (bits)
4096
Package Body Material
CERAMIC, METAL-SEALED COFIRED
Seated Height-Max (mm)
8.382
Supply Voltage-Max (V)
5.5
Supply Voltage-Min (V)
4.5
Supply Voltage-Nom (V)
5
Number of Words (words)
512
Operating Temperature-Max (Cel)
125
Operating Temperature-Min (Cel)
-55