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AS58C1001F-25

AUSTIN SEMICONDUCTOR INC

AUSTIN SEMICONDUCTOR INC AS58C1001F-25
  • ECCN
    3A001.a.2.c
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Ready/Busy
    YES
  • Technology
    CMOS
  • Toggle Bit
    NO
  • Data Polling
    YES
  • JESD-30 Code
    R-XDFP-F32
  • Memory Width
    8
  • Package Code
    DFP
  • Package Shape
    RECTANGULAR
  • Package Style
    FLATPACK Meter
  • Surface Mount
    YES
  • Terminal Form
    FLAT
  • J-STD-609 Code
    e0
  • Memory IC Type
    EEPROM
  • Parallel/Serial
    PARALLEL
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • DLA Qualification
    Not Qualified
  • Page Size (words)
    128
  • Temperature Grade
    MILITARY
  • Terminal Position
    DUAL
  • Memory Organization
    128KX8
  • Number of Terminals
    32
  • Terminal Pitch (mm)
    1.27
  • Access Time-Max (ns)
    250
  • Number of Words Code
    128K
  • Memory Density (bits)
    1048576
  • Package Body Material
    CERAMIC
  • Command User Interface
    NO
  • Supply Voltage-Nom (V)
    5
  • Number of Words (words)
    131072
  • Standby Current-Max (A)
    2.0E-5
  • Supply Current-Max (mA)
    45
  • Package Equivalence Code
    FL32,.4
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -55

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AS58C1001F-25
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AS58C1001F-25