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AM30LV0064DJ40F2ET

Advanced Micro Devices, Inc. (AMD)

Advanced Micro Devices, Inc. (AMD) AM30LV0064DJ40F2ET
  • ECCN
    3A001.a.2.c
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Ready/Busy
    YES
  • Technology
    CMOS
  • Toggle Bit
    NO
  • Data Polling
    NO
  • JESD-30 Code
    R-PDSO-G40
  • Memory Width
    8
  • Package Code
    TSOP
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE, THIN PROFILE Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • J-STD-609 Code
    e0
  • Memory IC Type
    FLASH
  • Reverse Pinout
    YES
  • Parallel/Serial
    PARALLEL
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • DLA Qualification
    Not Qualified
  • Page Size (words)
    512
  • Temperature Grade
    MILITARY
  • Terminal Position
    DUAL
  • Memory Organization
    8MX8
  • Number of Terminals
    40
  • Sector Size (words)
    8K
  • Access Time-Max (ns)
    35
  • Number of Words Code
    8M
  • Memory Density (bits)
    67108864
  • Package Body Material
    PLASTIC/EPOXY
  • Command User Interface
    YES
  • Number of Sectors/Size
    1K
  • Number of Words (words)
    8388608
  • Standby Current-Max (A)
    5.0E-5
  • Supply Current-Max (mA)
    20
  • Package Equivalence Code
    TSOP40/44(UNSPEC)
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -55

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AM30LV0064DJ40F2ET
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AM30LV0064DJ40F2ET