产品制造商
提交询价BOM 工具

AM29LV1282MH110RPHI

SPANSION INC.

SPANSION INC. AM29LV1282MH110RPHI
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Type
    NOR TYPE
  • Width
    11 mm
  • Length
    13 mm
  • Boot Block
    BOTTOM/TOP
  • Technology
    CMOS
  • JESD-30 Code
    R-PBGA-B80
  • Memory Width
    32
  • Organization
    8MX32
  • Package Code
    LBGA
  • JESD-609 Code
    e0
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, LOW PROFILE Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory Density
    268435456 bit
  • Memory IC Type
    FLASH MODULE
  • Operating Mode
    ASYNCHRONOUS
  • Terminal Pitch
    1 mm
  • Access Time-Max
    110 ns
  • Number of Words
    8388608 words
  • Parallel/Serial
    PARALLEL
  • Terminal Finish
    TIN LEAD
  • Seated Height-Max
    1.6 mm
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Number of Functions
    1
  • Number of Terminals
    80
  • Programming Voltage
    3.3 V
  • Number of Words Code
    8M
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Alternate Memory Width
    16
  • Operating Temperature-Max
    85 Cel
  • Operating Temperature-Min
    -40 Cel
  • Supply Voltage-Max (Vsup)
    3.6 V
  • Supply Voltage-Min (Vsup)
    3 V
  • Supply Voltage-Nom (Vsup)
    3.3 V
  • Moisture Sensitivity Level
    3

AM29LV1282MH110RPHI有0家供应商货源可供购买或竞价

提交询价

您的询价单将直接发送给我们的销售专家: Pari

提交询价
AM29LV1282MH110RPHI
提交询价
AM29LV1282MH110RPHI