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AM27S55ADC

Advanced Micro Devices, Inc. (AMD)

Advanced Micro Devices, Inc. (AMD) AM27S55ADC
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • Width
    7.62 mm
  • Length
    31.9405 mm
  • Technology
    BIPOLAR
  • JESD-30 Code
    R-GDIP-T24
  • Memory Width
    8
  • Organization
    4KX8
  • Package Code
    DIP
  • JESD-609 Code
    e0
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • Memory Density
    32768 bit
  • Memory IC Type
    OTP ROM
  • Operating Mode
    SYNCHRONOUS
  • Terminal Pitch
    2.54 mm
  • Access Time-Max
    10 ns
  • Number of Words
    4096 words
  • Parallel/Serial
    PARALLEL
  • Terminal Finish
    TIN LEAD
  • Seated Height-Max
    5.08 mm
  • Temperature Grade
    COMMERCIAL EXTENDED
  • Terminal Position
    DUAL
  • Supply Current-Max
    185 mA
  • Number of Functions
    1
  • Number of Terminals
    24
  • Number of Words Code
    4K
  • Qualification Status
    Not Qualified
  • Package Body Material
    CERAMIC, GLASS-SEALED
  • Output Characteristics
    3-STATE
  • Package Equivalence Code
    DIP24,.3
  • Operating Temperature-Max
    75 Cel
  • Operating Temperature-Min
    0 Cel
  • Supply Voltage-Max (Vsup)
    5.25 V
  • Supply Voltage-Min (Vsup)
    4.75 V
  • Supply Voltage-Nom (Vsup)
    5 V

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AM27S55ADC