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AM27S33DCTB

Advanced Micro Devices, Inc. (AMD)

Advanced Micro Devices, Inc. (AMD) AM27S33DCTB
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • Technology
    TTL
  • JESD-30 Code
    R-XDIP-T18
  • Memory Width
    8
  • Package Code
    DIP
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • J-STD-609 Code
    e0
  • Memory IC Type
    OTP ROM
  • Operating Mode
    ASYNCHRONOUS
  • Parallel/Serial
    PARALLEL
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    DUAL
  • Memory Organization
    64KX8
  • Number of Functions
    1
  • Number of Terminals
    18
  • Terminal Pitch (mm)
    2.54
  • Access Time-Max (ns)
    120
  • Number of Words Code
    64K
  • Memory Density (bits)
    524288
  • Package Body Material
    CERAMIC
  • Supply Voltage-Max (V)
    5.5
  • Supply Voltage-Min (V)
    4.5
  • Supply Voltage-Nom (V)
    5
  • Number of Words (words)
    1024
  • Supply Current-Max (mA)
    140
  • Package Equivalence Code
    DIP18,.3
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    0

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AM27S33DCTB
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AM27S33DCTB