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AM2764ADCB

Advanced Micro Devices, Inc. (AMD)

Advanced Micro Devices, Inc. (AMD) AM2764ADCB
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • I/O Type
    COMMON
  • Technology
    NMOS
  • Width (mm)
    15.24
  • Length (mm)
    37.1475
  • JESD-30 Code
    R-GDIP-T28
  • Memory Width
    8
  • Package Code
    WDIP
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE, WINDOW Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • J-STD-609 Code
    e0
  • Memory IC Type
    OTP ROM
  • Operating Mode
    ASYNCHRONOUS
  • Parallel/Serial
    PARALLEL
  • Terminal Finish
    TIN LEAD
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    DUAL
  • Memory Organization
    8KX8
  • Number of Functions
    1
  • Number of Terminals
    28
  • Terminal Pitch (mm)
    2.54
  • Access Time-Max (ns)
    250
  • Number of Words Code
    8K
  • Memory Density (bits)
    65536
  • Package Body Material
    CERAMIC, GLASS-SEALED
  • Output Characteristics
    3-STATE
  • Seated Height-Max (mm)
    5.588
  • Supply Voltage-Max (V)
    5.25
  • Supply Voltage-Min (V)
    4.75
  • Supply Voltage-Nom (V)
    5
  • Number of Words (words)
    8192
  • Programming Voltage (V)
    12.5
  • Supply Current-Max (mA)
    70
  • Package Equivalence Code
    DIP28,.6
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    0

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AM2764ADCB
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AM2764ADCB