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AM26LS30MF

PHILIPS SEMICONDUCTORS

PHILIPS SEMICONDUCTORS AM26LS30MF
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • Technology
    TTL
  • JESD-30 Code
    R-XDIP-T16
  • Package Code
    DIP
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • J-STD-609 Code
    e0
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • DLA Qualification
    Not Qualified
  • Interface IC Type
    LINE DRIVER
  • Out Swing-Min (V)
    2
  • Temperature Grade
    MILITARY
  • Terminal Position
    DUAL
  • Differential Output
    YES
  • Number of Terminals
    16
  • Terminal Pitch (mm)
    2.54
  • Driver Number of Bits
    2
  • Package Body Material
    CERAMIC
  • Output Characteristics
    3-STATE
  • Transmit Delay-Max (ns)
    300
  • Package Equivalence Code
    DIP16,.3
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -55
  • High Level Input Current-Max (A)
    4.0E-5

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AM26LS30MF
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AM26LS30MF