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ALXC800EETJCVD

Advanced Micro Devices, Inc. (AMD)

Advanced Micro Devices, Inc. (AMD) ALXC800EETJCVD
  • HTS Code
    8473.30.11.80
  • SB Code
    8542.31.00.25
  • Speed
    500 rpm
  • Width
    40 mm
  • Format
    FLOATING POINT
  • Length
    40 mm
  • Bit Size
    32
  • Technology
    CMOS
  • JESD-30 Code
    S-PBGA-B481
  • Package Code
    HBGA
  • Boundary Scan
    YES
  • JESD-609 Code
    e2
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, HEAT SINK/SLUG Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Low Power Mode
    YES
  • Terminal Pitch
    1.27 mm
  • Terminal Finish
    TIN SILVER
  • Integrated Cache
    YES
  • Address Bus Width
    32
  • Seated Height-Max
    2.59 mm
  • Temperature Grade
    OTHER
  • Terminal Position
    BOTTOM
  • Additional Feature
    ALSO REQUIRES 3.3V SUPPLY
  • Supply Voltage-Max
    1.24 V
  • Supply Voltage-Min
    1.16 V
  • Supply Voltage-Nom
    1.2 V
  • Number of Terminals
    481
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • External Data Bus Width
    32
  • Package Equivalence Code
    BGA481,31X31,50
  • Operating Temperature-Max
    85 Cel
  • Operating Temperature-Min
    0 Cel
  • Moisture Sensitivity Level
    3
  • uPs/uCs/Peripheral ICs Type
    MICROPROCESSOR

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ALXC800EETJCVD
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ALXC800EETJCVD