Integrated Device Technology, Inc. 8V89316BAG | 搜芯易Sourcengine

Integrated Device Technology, Inc. 8V89316BAG

生命周期状态
Transferred
RoHS
符合RoHS标准
REACH
REACH compliant
说明
CABGA 15.00x15.00x1.53 mm 1.00mm Pitch
类别
Semiconductors UPs/uCs/Peripheral ICs Other uPs/uCs/Peripheral ICs MICROPROCESSOR CIRCUIT

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.39.00.01
SB Code
8542.39.00.00

Technology
CMOS
Width (mm)
15
Length (mm)
15
JESD-30 Code
S-PBGA-B196
Package Code
LBGA
Package Shape
SQUARE
Package Style
GRID ARRAY, LOW PROFILE Meter
Surface Mount
YES
Terminal Form
BALL
J-STD-609 Code
e1
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Temperature Grade
INDUSTRIAL
Terminal Position
BOTTOM
Number of Terminals
196
Terminal Pitch (mm)
1
Package Body Material
PLASTIC/EPOXY
Seated Height-Max (mm)
1.69
Supply Voltage-Nom (V)
3.3
Moisture Sensitivity Level
3
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR CIRCUIT
Peak Reflow Temperature (Cel)
260
Operating Temperature-Max (Cel)
85
Operating Temperature-Min (Cel)
-40