Integrated Device Technology, Inc. 89TSF553BL | 搜芯易Sourcengine

Integrated Device Technology, Inc. 89TSF553BL

生命周期状态
Transferred
REACH
REACH compliant
说明
Microprocessor Circuit, CMOS, PBGA960
类别
Semiconductors UPs/uCs/Peripheral ICs Other uPs/uCs/Peripheral ICs MICROPROCESSOR CIRCUIT

HTS Code
8542.31.00.30
SB Code
8542.31.00.30

Technology
CMOS
Width (mm)
35
Length (mm)
35
JESD-30 Code
S-PBGA-B960
Package Code
BGA
Package Shape
SQUARE
Package Style
GRID ARRAY Meter
Surface Mount
YES
Terminal Form
BALL
J-STD-609 Code
e0
Terminal Finish
Tin/Lead (Sn/Pb)
DLA Qualification
Not Qualified
Temperature Grade
OTHER
Terminal Position
BOTTOM
Number of Terminals
960
Package Body Material
PLASTIC/EPOXY
Seated Height-Max (mm)
3.29
Supply Voltage-Max (V)
1.89
Supply Voltage-Min (V)
1.71
Supply Voltage-Nom (V)
1.8
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR CIRCUIT
Operating Temperature-Max (Cel)
85
Operating Temperature-Min (Cel)
0