Integrated Device Technology, Inc. 89HPES12NT3ZBBCI8 | 搜芯易Sourcengine

Integrated Device Technology, Inc. 89HPES12NT3ZBBCI8

生命周期状态
Transferred
说明
CABGA 19.00x19.00x1.40 mm 1.00mm Pitch
类别
Semiconductors UPs/uCs/Peripheral ICs Bus Controllers BUS CONTROLLER, PCI

ECCN
3A991.a.2
ECCN Governance
EAR
HTS Code
8542.31.00.30
SB Code
8542.31.00.30

Technology
CMOS
Width (mm)
19
Length (mm)
19
JESD-30 Code
S-PBGA-B324
Package Code
LBGA
Package Shape
SQUARE
Package Style
GRID ARRAY, LOW PROFILE Meter
Surface Mount
YES
Terminal Form
BALL
J-STD-609 Code
e0
Terminal Finish
TIN LEAD
Address Bus Width
0
Bus Compatibility
PCI; SMBUS
DLA Qualification
Not Qualified
Temperature Grade
INDUSTRIAL
Terminal Position
BOTTOM
Number of Terminals
324
Terminal Pitch (mm)
1
Package Body Material
PLASTIC/EPOXY
Seated Height-Max (mm)
1.5
Supply Voltage-Max (V)
1.1
Supply Voltage-Min (V)
0.9
Supply Voltage-Nom (V)
1
External Data Bus Width
0
Package Equivalence Code
BGA324,18X18,40
Clock Frequency-Max (MHz)
125
Moisture Sensitivity Level
3
uPs/uCs/Peripheral ICs Type
BUS CONTROLLER, PCI
Data Transfer Rate-Max (MBps)
6000
Peak Reflow Temperature (Cel)
225
Operating Temperature-Max (Cel)
85
Operating Temperature-Min (Cel)
-40
Time@Peak Reflow Temperature-Max (s)
20