Integrated Device Technology, Inc. 89HPES12N3AZGBCG | 搜芯易Sourcengine

Integrated Device Technology, Inc. 89HPES12N3AZGBCG

生命周期状态
Transferred
RoHS
符合RoHS标准
REACH
REACH compliant
说明
CABGA 19.00x19.00x1.40 mm 1.00mm Pitch
类别
Semiconductors UPs/uCs/Peripheral ICs Bus Controllers BUS CONTROLLER, PCI

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.39.00.01
SB Code
8542.39.00.00

Width
19 mm
Length
19 mm
Technology
CMOS
JESD-30 Code
S-PBGA-B324
Package Code
LBGA
JESD-609 Code
e1
Package Shape
SQUARE
Package Style
GRID ARRAY, LOW PROFILE Meter
Surface Mount
YES
Terminal Form
BALL
Terminal Pitch
1 mm
Terminal Finish
TIN SILVER COPPER
Address Bus Width
0
Bus Compatibility
PCI
Seated Height-Max
1.5 mm
Temperature Grade
COMMERCIAL
Terminal Position
BOTTOM
Additional Feature
ALSO REQUIRES 3.3V SUPPLY
Supply Voltage-Max
1.1 V
Supply Voltage-Min
0.9 V
Supply Voltage-Nom
1 V
Clock Frequency-Max
125 MHz
Number of Terminals
324
Qualification Status
Not Qualified
Package Body Material
PLASTIC/EPOXY
External Data Bus Width
0
Package Equivalence Code
BGA324,18X18,40
Operating Temperature-Max
70 Cel
Operating Temperature-Min
0 Cel
Moisture Sensitivity Level
3
uPs/uCs/Peripheral ICs Type
BUS CONTROLLER, PCI
Peak Reflow Temperature (Cel)
260
Time@Peak Reflow Temperature-Max (s)
30