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89HPES12N3AZCBCGI

Integrated Device Technology, Inc.

Integrated Device Technology, Inc. 89HPES12N3AZCBCGI
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • Width
    19 mm
  • Length
    19 mm
  • Technology
    CMOS
  • JESD-30 Code
    S-PBGA-B324
  • Package Code
    LBGA
  • JESD-609 Code
    e1
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, LOW PROFILE Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Terminal Pitch
    1 mm
  • Terminal Finish
    Tin/Silver/Copper (Sn/Ag/Cu)
  • Address Bus Width
    0
  • Bus Compatibility
    PCI
  • Seated Height-Max
    1.5 mm
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Additional Feature
    ALSO REQUIRES 3.3V SUPPLY
  • Supply Voltage-Max
    1.1 V
  • Supply Voltage-Min
    0.9 V
  • Supply Voltage-Nom
    1 V
  • Clock Frequency-Max
    125 MHz
  • Number of Terminals
    324
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • External Data Bus Width
    0
  • Package Equivalence Code
    BGA324,18X18,40
  • Operating Temperature-Max
    85 Cel
  • Operating Temperature-Min
    -40 Cel
  • Moisture Sensitivity Level
    3
  • uPs/uCs/Peripheral ICs Type
    BUS CONTROLLER, PCI
  • Peak Reflow Temperature (Cel)
    260
  • Time@Peak Reflow Temperature-Max (s)
    30

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89HPES12N3AZCBCGI
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