Integrated Device Technology, Inc. 89HPES12N3A1ZCBCG8
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • JESD-30 Code
    S-PBGA-B324
  • Package Code
    BGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e1
  • Terminal Finish
    TIN SILVER COPPER
  • Address Bus Width
    0
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    BOTTOM
  • Number of Terminals
    324
  • Terminal Pitch (mm)
    1
  • Package Body Material
    PLASTIC/EPOXY
  • Supply Voltage-Max (V)
    1.1
  • Supply Voltage-Min (V)
    0.9
  • Supply Voltage-Nom (V)
    1
  • External Data Bus Width
    0
  • Package Equivalence Code
    BGA324,18X18,40
  • Clock Frequency-Max (MHz)
    125
  • Moisture Sensitivity Level
    3
  • uPs/uCs/Peripheral ICs Type
    BUS CONTROLLER, PCI
  • Peak Reflow Temperature (Cel)
    260
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    0
  • Time@Peak Reflow Temperature-Max (s)
    30

89HPES12N3A1ZCBCG8有0家供应商货源可供购买或竞价

提交询价

您的询价单将直接发送给我们的销售专家: Pari

提交询价
89HPES12N3A1ZCBCG8
提交询价
89HPES12N3A1ZCBCG8