Integrated Device Technology, Inc. 89H64H16G3YCBLGI | 搜芯易Sourcengine

Integrated Device Technology, Inc. 89H64H16G3YCBLGI

生命周期状态
Transferred
RoHS
符合RoHS标准
REACH
REACH compliant
说明
FCBGA 35.00x35.00x2.82 mm 1.00mm Pitch
类别
Semiconductors UPs/uCs/Peripheral ICs Bus Controllers BUS CONTROLLER, PCI

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.39.00.01
SB Code
8542.39.00.00

Technology
CMOS
Width (mm)
35
Length (mm)
35
JESD-30 Code
S-PBGA-B1156
Package Code
BGA
Package Shape
SQUARE
Package Style
GRID ARRAY Meter
Surface Mount
YES
Terminal Form
BALL
J-STD-609 Code
e1
Terminal Finish
TIN SILVER COPPER
Bus Compatibility
ISA; VGA
DLA Qualification
Not Qualified
Temperature Grade
INDUSTRIAL
Terminal Position
BOTTOM
Number of Terminals
1156
Terminal Pitch (mm)
1
Package Body Material
PLASTIC/EPOXY
Seated Height-Max (mm)
3.42
Supply Voltage-Max (V)
1.1
Supply Voltage-Min (V)
0.95
Supply Voltage-Nom (V)
1
Supply Current-Max (mA)
8625
Drive Interface Standard
IEEE 1149.6AC; IEEE 1149.1
Package Equivalence Code
BGA1156,34X34,40
Clock Frequency-Max (MHz)
100
Moisture Sensitivity Level
4
uPs/uCs/Peripheral ICs Type
BUS CONTROLLER, PCI
Peak Reflow Temperature (Cel)
245
Operating Temperature-Max (Cel)
85
Operating Temperature-Min (Cel)
-40