Integrated Device Technology, Inc. 89H24NT6AG2ZCHLGI8
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • Technology
    CMOS
  • JESD-30 Code
    S-PBGA-B484
  • Package Code
    BGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e1
  • Terminal Finish
    TIN SILVER COPPER
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Number of Terminals
    484
  • Terminal Pitch (mm)
    1
  • Package Body Material
    PLASTIC/EPOXY
  • Package Equivalence Code
    BGA484,22X22,40
  • Moisture Sensitivity Level
    4
  • uPs/uCs/Peripheral ICs Type
    BUS CONTROLLER, PCI
  • Peak Reflow Temperature (Cel)
    250
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40

89H24NT6AG2ZCHLGI8有0家供应商货源可供购买或竞价

提交询价

您的询价单将直接发送给我们的销售专家: Pari

提交询价
89H24NT6AG2ZCHLGI8
提交询价
89H24NT6AG2ZCHLGI8