Integrated Device Technology, Inc. 89H24NT6AG2ZCHLG8 | 搜芯易Sourcengine

Integrated Device Technology, Inc. 89H24NT6AG2ZCHLG8

生命周期状态
Transferred
RoHS
符合RoHS标准
REACH
REACH compliant
说明
FCBGA 23.00x23.00x2.92 mm 1.00mm Pitch
类别
Semiconductors UPs/uCs/Peripheral ICs Bus Controllers BUS CONTROLLER, PCI

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.39.00.01
SB Code
8542.39.00.00

Technology
CMOS
JESD-30 Code
S-PBGA-B484
Package Code
BGA
Package Shape
SQUARE
Package Style
GRID ARRAY Meter
Surface Mount
YES
Terminal Form
BALL
J-STD-609 Code
e1
Terminal Finish
TIN SILVER COPPER
DLA Qualification
Not Qualified
Temperature Grade
COMMERCIAL
Terminal Position
BOTTOM
Number of Terminals
484
Terminal Pitch (mm)
1
Package Body Material
PLASTIC/EPOXY
Package Equivalence Code
BGA484,22X22,40
Moisture Sensitivity Level
4
uPs/uCs/Peripheral ICs Type
BUS CONTROLLER, PCI
Peak Reflow Temperature (Cel)
250
Operating Temperature-Max (Cel)
70
Operating Temperature-Min (Cel)
0