Integrated Device Technology, Inc. 859S0424BGILF | 搜芯易Sourcengine

Integrated Device Technology, Inc. 859S0424BGILF

生命周期状态
Transferred
RoHS
符合RoHS标准
REACH
REACH compliant
说明
TSSOP 7.80x4.40x1.00 mm 0.65mm Pitch
类别
Semiconductors Logic ICs Clock Drivers LOW SKEW CLOCK DRIVER

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.39.00.01
SB Code
8542.39.00.00

Family
859S
Width (mm)
4.4
Length (mm)
7.8
JESD-30 Code
R-PDSO-G24
Package Code
TSSOP
Logic IC Type
LOW SKEW CLOCK DRIVER
Package Shape
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH Meter
Surface Mount
YES
Terminal Form
GULL WING
J-STD-609 Code
e3
Terminal Finish
MATTE TIN
DLA Qualification
Not Qualified
Temperature Grade
INDUSTRIAL
Terminal Position
DUAL
Additional Feature
ALSO OPERATES AT 3.3V SUPPLY
Input Conditioning
DIFFERENTIAL MUX
Number of Functions
1
Number of Terminals
24
Terminal Pitch (mm)
0.65
Package Body Material
PLASTIC/EPOXY
Number of True Outputs
4
Seated Height-Max (mm)
1.2
Supply Voltage-Max (V)
2.625
Supply Voltage-Min (V)
2.375
Supply Voltage-Nom (V)
2.5
Package Equivalence Code
TSSOP24,.25
Moisture Sensitivity Level
1
Number of Inverted Outputs
0
Peak Reflow Temperature (Cel)
260
Operating Temperature-Max (Cel)
85
Operating Temperature-Min (Cel)
-40
Propagation Delay-Max@Nom-Sup (ns)
0.8
Time@Peak Reflow Temperature-Max (s)
30