CONEXCON GROUP 8426-13682 | 搜芯易Sourcengine

CONEXCON GROUP 8426-13682

生命周期状态
Contact Mfr
RoHS
符合RoHS标准
说明
IC Socket, DIP68, 68 Contact(s), 1.778mm Term Pitch, 15.24mm Row Spacing, Solder
类别
Interconnects Sockets and Chip Carriers

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8536.69.40.40
SB Code
8536.69.40.40

Body Depth
0.165 inch
Body Length
2.397 inch
Body Breadth
0.694 inch
Contact Style
RND PIN-SKT
Current Rating
1 A
Mounting Style
STRAIGHT
Terminal Pitch
1.778 mm
Contact Material
BE-CU
Housing Material
GLASS FILLED POLYPHENYLENE SULPHIDE
Termination Type
SOLDER
Device Socket Type
IC SOCKET
Number of Contacts
68
Device Type Used On
DIP68
PCB Contact Pattern
RECTANGULAR
Mating Contact Pitch
0.07 inch
Insulation Resistance
1000000000 ohm
Contact Finish - Mating
AU ON NI
PCB Contact Row Spacing
15.24 mm
Operating Temperature-Max
105 Cel
Operating Temperature-Min
-40 Cel
Dielectric Withstanding Voltage
1000VAC V