Integrated Device Technology, Inc. 8413209SA | 搜芯易Sourcengine

Integrated Device Technology, Inc. 8413209SA

生命周期状态
Transferred
REACH
REACH compliant
说明
CPACK 13.72x6.99x1.78 mm 1.27mm Pitch
类别
Semiconductors Memory ICs SRAMs OTHER SRAM

ECCN
3A001.a.2.c
ECCN Governance
EAR
HTS Code
8542.32.00.41
SB Code
8542.32.00.40

Technology
CMOS
JESD-30 Code
R-GDFP-F20
Memory Width
1
Package Code
DFP
Package Shape
RECTANGULAR
Package Style
FLATPACK Meter
Surface Mount
YES
Terminal Form
FLAT
J-STD-609 Code
e0
Memory IC Type
OTHER SRAM
Operating Mode
ASYNCHRONOUS
Parallel/Serial
PARALLEL
Terminal Finish
TIN LEAD
DLA Qualification
Not Qualified
Temperature Grade
MILITARY
Terminal Position
DUAL
Memory Organization
16KX1
Number of Functions
1
Number of Terminals
20
Access Time-Max (ns)
45
Number of Words Code
16K
Memory Density (bits)
16384
Package Body Material
CERAMIC, GLASS-SEALED
Supply Voltage-Max (V)
5.5
Supply Voltage-Min (V)
4.5
Supply Voltage-Nom (V)
5
Number of Words (words)
16384
Moisture Sensitivity Level
1
Peak Reflow Temperature (Cel)
260
Operating Temperature-Max (Cel)
125
Operating Temperature-Min (Cel)
-55
Screening Level / Reference Standard
MIL-STD-883