CONEXCON GROUP 8305-2301 | 搜芯易Sourcengine

CONEXCON GROUP 8305-2301

生命周期状态
Contact Mfr
说明
IC Socket, DIP30, 30 Contact(s), 1.778mm Term Pitch, 10.16mm Row Spacing, Solder
类别
Interconnects Sockets and Chip Carriers

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8536.69.40.40
SB Code
8536.69.40.40

Body Depth
0.201 inch
Body Length
1.05 inch
Body Breadth
0.496 inch
Contact Style
BELLOWED TYPE
Mounting Style
STRAIGHT
Terminal Pitch
1.778 mm
Contact Material
P-CUSN
Housing Material
GLASS FILLED POLYESTER
Termination Type
SOLDER
Additional Feature
LOW PROFILE
Device Socket Type
IC SOCKET
Number of Contacts
30
Device Type Used On
DIP30
PCB Contact Pattern
RECTANGULAR
Mating Contact Pitch
0.07 inch
Contact Finish - Mating
SN
PCB Contact Row Spacing
10.16 mm
Contact Finish - Termination
TIN