Integrated Device Technology, Inc. 80HSPS1616RMI | 搜芯易Sourcengine

Integrated Device Technology, Inc. 80HSPS1616RMI

生命周期状态
Transferred
说明
FCBGA 21.00x21.00x2.75 mm 1.00mm Pitch
类别
Semiconductors UPs/uCs/Peripheral ICs Other uPs/uCs/Peripheral ICs MICROPROCESSOR CIRCUIT

HTS Code
8542.39.00.01
SB Code
8542.39.00.00

Technology
CMOS
Width (mm)
21
Length (mm)
21
JESD-30 Code
S-PBGA-B400
Package Code
HBGA
Package Shape
SQUARE
Package Style
GRID ARRAY, HEAT SINK/SLUG Meter
Surface Mount
YES
Terminal Form
BALL
Temperature Grade
INDUSTRIAL
Terminal Position
BOTTOM
Number of Terminals
400
Terminal Pitch (mm)
1
Package Body Material
PLASTIC/EPOXY
Seated Height-Max (mm)
2.83
Supply Voltage-Max (V)
1.05
Supply Voltage-Min (V)
0.95
Supply Voltage-Nom (V)
1
Moisture Sensitivity Level
4
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR CIRCUIT
Peak Reflow Temperature (Cel)
245
Operating Temperature-Max (Cel)
85
Operating Temperature-Min (Cel)
-40