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7MB4066S17P

Integrated Device Technology, Inc.

Integrated Device Technology, Inc. 7MB4066S17P
  • ECCN
    3A991.b.2.a
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.41
  • SB Code
    8542.32.00.40
  • I/O Type
    COMMON
  • Technology
    CMOS
  • Width (mm)
    15.494
  • Length (mm)
    60.96
  • JESD-30 Code
    R-PDMA-T48
  • Memory Width
    16
  • Package Code
    DIP
  • Package Shape
    RECTANGULAR
  • Package Style
    MICROELECTRONIC ASSEMBLY Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • J-STD-609 Code
    e0
  • Memory IC Type
    SRAM MODULE
  • Operating Mode
    ASYNCHRONOUS
  • Parallel/Serial
    PARALLEL
  • Terminal Finish
    TIN LEAD
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    DUAL
  • Memory Organization
    256KX16
  • Number of Functions
    1
  • Number of Terminals
    48
  • Terminal Pitch (mm)
    2.54
  • Access Time-Max (ns)
    17
  • Number of Words Code
    256K
  • Memory Density (bits)
    4194304
  • Package Body Material
    PLASTIC/EPOXY
  • Output Characteristics
    3-STATE
  • Seated Height-Max (mm)
    8.89
  • Supply Voltage-Max (V)
    5.5
  • Supply Voltage-Min (V)
    4.5
  • Supply Voltage-Nom (V)
    5
  • Number of Words (words)
    262144
  • Supply Current-Max (mA)
    800
  • Package Equivalence Code
    DIP48,.6
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    0

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7MB4066S17P
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7MB4066S17P