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74SSTUBH32868ABKG8

Integrated Device Technology, Inc.

Integrated Device Technology, Inc. 74SSTUBH32868ABKG8
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • Family
    SSTU
  • Technology
    TTL
  • Width (mm)
    6
  • Length (mm)
    15
  • JESD-30 Code
    R-PBGA-B176
  • Package Code
    FBGA
  • Trigger Type
    POSITIVE EDGE
  • Logic IC Type
    D FLIP-FLOP
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e1
  • Number of Bits
    28
  • fmax-Min (MHz)
    410
  • Output Polarity
    TRUE
  • Terminal Finish
    TIN SILVER COPPER
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    BOTTOM
  • Number of Functions
    1
  • Number of Terminals
    176
  • Terminal Pitch (mm)
    0.65
  • Package Body Material
    PLASTIC/EPOXY
  • Propagation Delay (ns)
    1.5
  • Supply Voltage-Max (V)
    1.9
  • Supply Voltage-Min (V)
    1.7
  • Supply Voltage-Nom (V)
    1.8
  • Package Equivalence Code
    BGA176,8X22,25
  • Moisture Sensitivity Level
    3
  • Peak Reflow Temperature (Cel)
    260
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    0
  • Time@Peak Reflow Temperature-Max (s)
    30

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74SSTUBH32868ABKG8
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74SSTUBH32868ABKG8