Integrated Device Technology, Inc. 74CBTLV3383PG8 | 搜芯易Sourcengine

Integrated Device Technology, Inc. 74CBTLV3383PG8

生命周期状态
Transferred
说明
TSSOP 7.80x4.40x1.00 mm 0.65mm Pitch
类别
Semiconductors Logic ICs Bus Driver/Transceivers BUS EXCHANGER

HTS Code
8542.39.00.01
SB Code
8542.39.00.00

Family
CBTLV/3B
Technology
CMOS
Width (mm)
4.4
Length (mm)
7.8
JESD-30 Code
R-PDSO-G24
Package Code
TSSOP
Logic IC Type
BUS EXCHANGER
Package Shape
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH Meter
Surface Mount
YES
Terminal Form
GULL WING
J-STD-609 Code
e0
Number of Bits
10
Number of Ports
4
Output Polarity
TRUE
Terminal Finish
TIN LEAD
DLA Qualification
Not Qualified
Temperature Grade
INDUSTRIAL
Terminal Position
DUAL
Number of Functions
1
Number of Terminals
24
Terminal Pitch (mm)
0.65
Package Body Material
PLASTIC/EPOXY
Output Characteristics
3-STATE
Propagation Delay (ns)
0.25
Seated Height-Max (mm)
1.2
Supply Voltage-Max (V)
3.6
Supply Voltage-Min (V)
2.3
Supply Voltage-Nom (V)
2.5
Package Equivalence Code
TSSOP24,.25
Moisture Sensitivity Level
1
Peak Reflow Temperature (Cel)
240
Operating Temperature-Max (Cel)
85
Operating Temperature-Min (Cel)
-40
Time@Peak Reflow Temperature-Max (s)
20