Integrated Device Technology, Inc. 72T6360L7-5BB | 搜芯易Sourcengine

Integrated Device Technology, Inc. 72T6360L7-5BB

生命周期状态
Transferred
说明
PBGA 19.00x19.00x1.76 mm 1.00mm Pitch
类别
Semiconductors UPs/uCs/Peripheral ICs Other uPs/uCs/Peripheral ICs MICROPROCESSOR CIRCUIT

HTS Code
8542.31.00.30
SB Code
8542.31.00.30

Technology
CMOS
JESD-30 Code
S-PBGA-B324
Package Code
BGA
Package Shape
SQUARE
Package Style
GRID ARRAY Meter
Surface Mount
YES
Terminal Form
BALL
J-STD-609 Code
e0
Terminal Finish
Tin/Lead (Sn63Pb37)
DLA Qualification
Not Qualified
Temperature Grade
COMMERCIAL
Terminal Position
BOTTOM
Number of Terminals
324
Package Body Material
PLASTIC/EPOXY
Supply Voltage-Max (V)
2.625
Supply Voltage-Min (V)
2.375
Supply Voltage-Nom (V)
2.5
Moisture Sensitivity Level
3
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR CIRCUIT
Peak Reflow Temperature (Cel)
225
Operating Temperature-Max (Cel)
70
Operating Temperature-Min (Cel)
0
Time@Peak Reflow Temperature-Max (s)
30