Integrated Device Technology, Inc. 72511L50G | 搜芯易Sourcengine

Integrated Device Technology, Inc. 72511L50G

生命周期状态
Transferred
说明
PGA 28.20x28.20x3.68 mm 2.54mm Pitch
类别
Semiconductors Memory ICs FIFOs BI-DIRECTIONAL FIFO

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.71
SB Code
8542.32.00.70

Technology
CMOS
JESD-30 Code
S-XPGA-P68
Memory Width
18
Organization
1KX18
Package Code
PGA
JESD-609 Code
e0
Package Shape
SQUARE
Package Style
GRID ARRAY Meter
Surface Mount
NO
Terminal Form
PIN/PEG
Memory Density
18432 bit
Memory IC Type
BI-DIRECTIONAL FIFO
Operating Mode
SYNCHRONOUS
Terminal Pitch
2.54 mm
Access Time-Max
50 ns
Number of Words
1024 words
Terminal Finish
TIN LEAD
Temperature Grade
COMMERCIAL
Terminal Position
PERPENDICULAR
Supply Current-Max
230 mA
Number of Terminals
68
Standby Current-Max
0.03 Amp
Number of Words Code
1K
Qualification Status
Not Qualified
Package Body Material
CERAMIC
Package Equivalence Code
PGA68,11X11
Operating Temperature-Max
70 Cel
Operating Temperature-Min
0 Cel
Supply Voltage-Nom (Vsup)
5 V
Clock Frequency-Max (fCLK)
15.4 MHz
Moisture Sensitivity Level
1
Peak Reflow Temperature (Cel)
260