Integrated Device Technology, Inc. 71V3558S133PFG | 搜芯易Sourcengine

Integrated Device Technology, Inc. 71V3558S133PFG

生命周期状态
Transferred
RoHS
符合RoHS标准
REACH
REACH compliant
说明
SRAM Chip Sync Single 3.3V 4.5M-Bit 256K x 18 4.2ns 100-Pin TQFP Tray
类别
Semiconductors Memory ICs

ECCN
3A991.B.2.A
ECCN Governance
EAR
HTS Code
8542.32.00.41
SB Code
8542.32.00.40

I/O Type
COMMON
Technology
CMOS
Width (mm)
14.0000
Length (mm)
20.0000
JESD-30 Code
R-PQFP-G100
Memory Width
18
Package Code
LQFP
Package Shape
RECTANGULAR
Package Style
FLATPACK, LOW PROFILE
Surface Mount
YES
Terminal Form
GULL WING
J-STD-609 Code
e3
Memory IC Type
ZBT SRAM
Operating Mode
SYNCHRONOUS
Parallel/Serial
PARALLEL
Terminal Finish
MATTE TIN
DLA Qualification
Not Qualified
Temperature Grade
COMMERCIAL
Terminal Position
QUAD
Memory Organization
256KX18
Number of Functions
1
Number of Terminals
100
Terminal Pitch (mm)
0.650
Access Time-Max (ns)
4.2000000000000000
Number of Words Code
256K
Memory Density (bits)
4718592.0000000000000000
Package Body Material
PLASTIC/EPOXY
Output Characteristics
3-STATE
Seated Height-Max (mm)
1.6000
Supply Voltage-Max (V)
3.46500
Supply Voltage-Min (V)
3.13500
Supply Voltage-Nom (V)
3.3
Number of Words (words)
262144.0000000000000000
Standby Current-Max (A)
0.040000000000000
Standby Voltage-Min (V)
3.140000
Supply Current-Max (mA)
300.000000000000000
Package Equivalence Code
QFP100,.63X.87
Clock Frequency-Max (MHz)
133.00000
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
260
Operating Temperature-Max (Cel)
70.0
Operating Temperature-Min (Cel)
0.0
Time@Peak Reflow Temperature-Max (s)
30