Integrated Device Technology, Inc. 70V914S25PFI9 | 搜芯易Sourcengine

Integrated Device Technology, Inc. 70V914S25PFI9

生命周期状态
Transferred
REACH
REACH compliant
说明
TQFP 14.00x14.00x1.40 mm 0.65mm Pitch
类别
Semiconductors Memory ICs SRAMs MULTI-PORT SRAM

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.41
SB Code
8542.32.00.40

Technology
CMOS
JESD-30 Code
S-PQFP-G80
Memory Width
9
Organization
4KX9
Package Code
QFP
JESD-609 Code
e0
Package Shape
SQUARE
Package Style
FLATPACK Meter
Surface Mount
YES
Terminal Form
GULL WING
Memory Density
36864 bit
Memory IC Type
MULTI-PORT SRAM
Operating Mode
SYNCHRONOUS
Access Time-Max
25 ns
Number of Words
4096 words
Parallel/Serial
PARALLEL
Terminal Finish
TIN LEAD
Temperature Grade
INDUSTRIAL
Terminal Position
QUAD
Number of Functions
1
Number of Terminals
80
Number of Words Code
4K
Package Body Material
PLASTIC/EPOXY
Operating Temperature-Max
85 Cel
Operating Temperature-Min
-40 Cel
Supply Voltage-Max (Vsup)
3.6 V
Supply Voltage-Min (Vsup)
3 V
Supply Voltage-Nom (Vsup)
3.3 V
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
240