Integrated Device Technology, Inc. 70V639S15PRF | 搜芯易Sourcengine

Integrated Device Technology, Inc. 70V639S15PRF

生命周期状态
Transferred
说明
TQFP 20.00x14.00x1.40 mm 0.50mm Pitch
类别
Semiconductors Memory ICs SRAMs MULTI-PORT SRAM

ECCN
3A991.b.2.a
ECCN Governance
EAR
HTS Code
8542.32.00.41
SB Code
8542.32.00.40

I/O Type
COMMON
Technology
CMOS
Width (mm)
14
Length (mm)
20
JESD-30 Code
R-PQFP-G128
Memory Width
18
Package Code
LFQFP
Package Shape
RECTANGULAR
Package Style
FLATPACK, LOW PROFILE, FINE PITCH Meter
Surface Mount
YES
Terminal Form
GULL WING
J-STD-609 Code
e0
Memory IC Type
MULTI-PORT SRAM
Operating Mode
ASYNCHRONOUS
Number of Ports
2
Parallel/Serial
PARALLEL
Terminal Finish
TIN LEAD
DLA Qualification
Not Qualified
Temperature Grade
COMMERCIAL
Terminal Position
QUAD
Memory Organization
128KX18
Number of Functions
1
Number of Terminals
128
Terminal Pitch (mm)
0.5
Access Time-Max (ns)
15
Number of Words Code
128K
Memory Density (bits)
2359296
Package Body Material
PLASTIC/EPOXY
Output Characteristics
3-STATE
Seated Height-Max (mm)
1.6
Supply Voltage-Max (V)
3.45
Supply Voltage-Min (V)
3.15
Supply Voltage-Nom (V)
3.3
Number of Words (words)
131072
Standby Current-Max (A)
0.015
Standby Voltage-Min (V)
3.15
Supply Current-Max (mA)
440
Package Equivalence Code
QFP128,.63X.87,20
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
225
Operating Temperature-Max (Cel)
70
Operating Temperature-Min (Cel)
0
Time@Peak Reflow Temperature-Max (s)
30