Integrated Device Technology, Inc. 70V5378S200BGG | 搜芯易Sourcengine

Integrated Device Technology, Inc. 70V5378S200BGG

生命周期状态
Transferred
RoHS
符合RoHS标准
REACH
REACH compliant
说明
PBGA 27.00x27.00x2.00 mm 1.27mm Pitch
类别
Semiconductors Memory ICs SRAMs MULTI-PORT SRAM

ECCN
3A991.b.2.b
ECCN Governance
EAR
HTS Code
8542.32.00.41
SB Code
8542.32.00.40

I/O Type
COMMON
Technology
CMOS
Width (mm)
27
Length (mm)
27
JESD-30 Code
S-PBGA-B272
Memory Width
18
Package Code
BGA
Package Shape
SQUARE
Package Style
GRID ARRAY Meter
Surface Mount
YES
Terminal Form
BALL
J-STD-609 Code
e1
Memory IC Type
MULTI-PORT SRAM
Operating Mode
SYNCHRONOUS
Number of Ports
4
Parallel/Serial
PARALLEL
Terminal Finish
TIN SILVER COPPER
DLA Qualification
Not Qualified
Temperature Grade
COMMERCIAL
Terminal Position
BOTTOM
Additional Feature
PIPELINED ARCHITECTURE
Memory Organization
32KX18
Number of Functions
1
Number of Terminals
272
Terminal Pitch (mm)
1.27
Access Time-Max (ns)
3
Number of Words Code
32K
Memory Density (bits)
589824
Package Body Material
PLASTIC/EPOXY
Output Characteristics
3-STATE
Seated Height-Max (mm)
2.54
Supply Voltage-Max (V)
3.45
Supply Voltage-Min (V)
3.15
Supply Voltage-Nom (V)
3.3
Number of Words (words)
32768
Standby Current-Max (A)
0.015
Standby Voltage-Min (V)
3.15
Supply Current-Max (mA)
470
Package Equivalence Code
BGA272,20X20,50
Clock Frequency-Max (MHz)
200
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
260
Operating Temperature-Max (Cel)
70
Operating Temperature-Min (Cel)
0