Integrated Device Technology, Inc. 70V27WL25BF | 搜芯易Sourcengine

Integrated Device Technology, Inc. 70V27WL25BF

生命周期状态
Discontinued
REACH
REACH compliant
说明
Application Specific SRAM, 32KX16, 25ns, CMOS, PBGA144
类别
Semiconductors Memory ICs SRAMs APPLICATION SPECIFIC SRAM

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.41
SB Code
8542.32.00.40

I/O Type
COMMON
Technology
CMOS
JESD-30 Code
S-PBGA-B144
Memory Width
16
Organization
32KX16
Package Code
FBGA
JESD-609 Code
e0
Package Shape
SQUARE
Package Style
GRID ARRAY, FINE PITCH Meter
Surface Mount
YES
Terminal Form
BALL
Memory Density
524288 bit
Memory IC Type
APPLICATION SPECIFIC SRAM
Operating Mode
ASYNCHRONOUS
Terminal Pitch
0.8 mm
Access Time-Max
25 ns
Number of Ports
2
Number of Words
32768 words
Parallel/Serial
PARALLEL
Terminal Finish
TIN LEAD
Temperature Grade
COMMERCIAL
Terminal Position
BOTTOM
Supply Current-Max
210 mA
Number of Terminals
144
Standby Current-Max
0.003 Amp
Standby Voltage-Min
3 V
Number of Words Code
32K
Qualification Status
Not Qualified
Package Body Material
PLASTIC/EPOXY
Output Characteristics
3-STATE
Package Equivalence Code
BGA144,13X13,32
Operating Temperature-Max
70 Cel
Operating Temperature-Min
0 Cel
Supply Voltage-Nom (Vsup)
3.3 V
Moisture Sensitivity Level
3