Integrated Device Technology, Inc. 70V27L55BF | 搜芯易Sourcengine

Integrated Device Technology, Inc. 70V27L55BF

生命周期状态
Transferred
说明
Application Specific SRAM, 32KX16, 55ns, CMOS, PBGA144
类别
Semiconductors Memory ICs SRAMs APPLICATION SPECIFIC SRAM

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.41
SB Code
8542.32.00.40

I/O Type
COMMON
Technology
CMOS
JESD-30 Code
S-PBGA-B144
Memory Width
16
Package Code
FBGA
Package Shape
SQUARE
Package Style
GRID ARRAY, FINE PITCH Meter
Surface Mount
YES
Terminal Form
BALL
J-STD-609 Code
e0
Memory IC Type
APPLICATION SPECIFIC SRAM
Operating Mode
ASYNCHRONOUS
Number of Ports
2
Parallel/Serial
PARALLEL
Terminal Finish
TIN LEAD
DLA Qualification
Not Qualified
Temperature Grade
COMMERCIAL
Terminal Position
BOTTOM
Memory Organization
32KX16
Number of Terminals
144
Terminal Pitch (mm)
0.8
Access Time-Max (ns)
55
Number of Words Code
32K
Memory Density (bits)
524288
Package Body Material
PLASTIC/EPOXY
Output Characteristics
3-STATE
Supply Voltage-Nom (V)
3.3
Number of Words (words)
32768
Standby Current-Max (A)
0.003
Standby Voltage-Min (V)
3
Supply Current-Max (mA)
180
Package Equivalence Code
BGA144,13X13,32
Moisture Sensitivity Level
3
Operating Temperature-Max (Cel)
70
Operating Temperature-Min (Cel)
0