Integrated Device Technology, Inc. 70T9169L7PF | 搜芯易Sourcengine

Integrated Device Technology, Inc. 70T9169L7PF

生命周期状态
Transferred
说明
TQFP 14.00x14.00x1.40 mm 0.50mm Pitch
类别
Semiconductors Memory ICs SRAMs MULTI-PORT SRAM

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.41
SB Code
8542.32.00.40

I/O Type
COMMON
Technology
CMOS
JESD-30 Code
S-PQFP-G100
Memory Width
9
Organization
16KX9
Package Code
QFP
JESD-609 Code
e0
Package Shape
SQUARE
Package Style
FLATPACK Meter
Surface Mount
YES
Terminal Form
GULL WING
Memory Density
147456 bit
Memory IC Type
MULTI-PORT SRAM
Operating Mode
SYNCHRONOUS
Terminal Pitch
0.5 mm
Access Time-Max
7 ns
Number of Ports
2
Number of Words
16384 words
Parallel/Serial
PARALLEL
Terminal Finish
TIN LEAD
Temperature Grade
COMMERCIAL
Terminal Position
QUAD
Additional Feature
FLOW-THROUGH OR PIPELINED ARCHITECTURE
Supply Current-Max
200 mA
Number of Functions
1
Number of Terminals
100
Standby Current-Max
0.003 Amp
Standby Voltage-Min
2.4 V
Number of Words Code
16K
Qualification Status
Not Qualified
Package Body Material
PLASTIC/EPOXY
Output Characteristics
3-STATE
Package Equivalence Code
QFP100,.63SQ,20
Operating Temperature-Max
70 Cel
Operating Temperature-Min
0 Cel
Supply Voltage-Max (Vsup)
2.6 V
Supply Voltage-Min (Vsup)
2.4 V
Supply Voltage-Nom (Vsup)
2.5 V
Clock Frequency-Max (fCLK)
83 MHz
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
240
Time@Peak Reflow Temperature-Max (s)
20